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2018年02月07日至09日 2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2018) (Hsinchu, Taiwan)

2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2018)

& 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics
Engineering (IEEE SMILE 2018)

Conference Chairs: Chen-Fu Chien, Jei-Zheng Wu, & Runliang Dou 
February 7 - 9, 2018, Hsinchu, Taiwan

Aims and Topics:

The joint conference of 2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2018) and 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE 2018) aims to disseminate recent theoretical and methodological developments, applications, and case studies in light of ongoing revolutions for manufacturing intelligence and smart manufacturing. Topics of interest include, but are not limited to, the following:

Big Data Analytics & Data Mining for Smart Manufacturing    Industry 4.0 & Cyber-Physical Systems

AI & Computational Intelligence for Smart Manufacturing     
Advanced Process Control/ Advanced Equipment Control

Internet of Things (IOT)         Virtual Metrology, Tool Health, Fault Detection & Classification 
Manufacturing Intelligence, Evolutionary Algorithms        
Circular Economics, Green Supply Chain & Sustainability 

Decision Technologies, Modeling & Decision Analysis       Augmented Reality, Virtual Reality

Simulation Optimization & Applications       Manufacturing Strategy & Manufacturing Innovation 
Corporate Resource Planning & ERP              User Experience & Innovative Design

Smart Production Facilities & Green Fab       Human-machine Collaboration, Ergonomics & Safety 
Predictive Maintenance, Quality & Reliability                      
Total Resource Management & Overall Resource Effectiveness 

Semiconductor & High-tech Manufacturing      Applications of Industrial Engineering & Logistics

Organized/sponsored by:

NTHU-TSMC Center for Manufacturing Excellence, National Tsing Hua University

Industrial Engineering and Management Program, Ministry of Science and Technology, Taiwan

Society for Excelling Enterprises and Decisions (SEED), Taiwan

Paper submission:

All papers must be written in English with a maximum length of 6 pages. Paper format, submission, 
and related information is updated: 
and submission page: For more details, please
consult Co-Chair, Professor Jei-Zheng Wu (

Special Issues for Post-Conference Publication:

Conference proceedings of full papers will be published by IEEE Xplore that is indexed by Ei Compendex. 
Selected papers will be recommended for reviews and possible publications in special issues of SCI journals 
includingJournal of Intelligent Manufacturing and others as in

Important Dates:

Deadline for Submission of Abstract and Special Session Proposals:October 31, 2017 
Deadline for Full Paper Submission for EI Indexed Proceedings for IEEE Xplore: October 31, 2017
Deadline for Full Paper/Presentation-only Abstract Submission:November 30, 2017 
Camera ReadyManuscript Submission:January 5, 2018

Registration Fee:

Full registration:  
US$500 (Early bird, before December 10, 2017) / US$600 (Regular)

Student registration: 
US$350 (Early bird, before December 30, 2017) / US$400(Regular)

Tutorial Session, Exhibit, and Factory Visiting:

This conference will provide a platform for related activities such as tutorial, exhibit, and factory 
visiting to enrich conference.

Venue: National Tsing Hua University (
(special offers of NTHU guest house and hotels nearby are available; visitor guide will be
provided in advance for visiting Taiwan and local tours).



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